HEA 2019_World Congress on High Entropy Alloys(11.17-20, 2019 *Seattle, Washington, USA)

*Website: https://www.tms.org/hea2019

The World Congress on High Entropy Alloys (HEA 2019) is a new, cross-disciplinary technical forum designed to share the latest research advances in materials with high configurational entropy, including both single-phase and multiphase (compositionally complex) alloys. HEA 2019 will feature highly focused technical talks on topics that include, but are not limited to, fundamental theory of alloy design, computational modeling and simulation, properties, processing, and applications of high entropy alloys.

Networking opportunities will also offer attendees a chance to informally discuss the latest developments in high entropy alloys, while also making valuable professional connections. The congress will attract research leaders from industry, government, and academics from across the globe, as well as students and postdocs interested in the science and engineering of metallic materials and high performance alloys. Scientists and engineers will be convened to facilitate linkages and collaborations on this promising technology, to hopefully lead to widespread application and adoption of these materials.

Thank You to Our Sponsors

Congress Sponsors and Organizers

Congress Sponsors and Organizers

This congress is sponsored by the Structural Materials Division and the Alloy Phases, High Temperature Alloys, and Refractory Metals & Materials Committees, and is being organized by the following individuals:
Chair Daniel Miracle, Air Force Research Laboratory, USA
Co-Chair John J. Lewandowski, Case Western Reserve University, USA
Organizing Team Irene J. Beyerlein, University of California, Santa Barbara, USA
Martin Heilmaier, Karlsruhe Institute of Technology, Germany
Hyoung Seop Kim, Pohang University of Science and Technology, South Korea
Ali Yousefiani, Boeing Research and Technology, USA

For More Information

For more information about this meeting, please complete the meeting inquiry form or contact:

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