5th World Congress on Integrated Computational Materials Engineering (ICME 2019) (7. 21-25, 2019 *Indianapolis, Indiana, USA)

*Website: ICME 2019

The 5th World Congress on Integrated Computational Materials Engineering (ICME 2019) convenes leading researchers and practitioners of ICME to share the latest knowledge and advances in the discipline. This congress is the recognized hub of interaction among software developers and process engineers along the entire production chain, as well as for materials scientists and engineers developing new materials. This is the only congress dedicated to bringing all stakeholders together from across nations, disciplines, and organizations to focus on integration priorities and gaps that need to be addressed in order to advance the field. At ICME 2019, attendees will gain insights on recent advances, new challenges, and the roadmap for overcoming them, giving them the opportunity to discuss and influence actual trends in the field. Visit the Technical Program page for more information on technical topics to be covered by this congress.

Who Will Benefit

Individuals working in research and development, software developers, metallurgists, materials scientists and engineers, process engineers, senior scientists, and chief technology officers will all benefit from presenting and/or attending ICME 2019.

Congress Sponsors and Organizers

This congress is sponsored by TMS Materials Processing &Manufacturing Division (MPMD) and the Integrated Computational Materials Engineering (ICME) Committee, and is being organized by the following individuals:

Lead Organizer Charles Fisher, Naval Surface Warfare Center, USA
Programming Vasisht Venkatesh, Pratt &Whitney, USA
Chair
Co-Organizers Danielle Cote, Worcester Polytechnic Institute, USA
Qiang Charles Feng, University of Science and Technology Beijing, China
Dana Frankel, QuesTek Innovations LLC, USA
B.P. Gautham, Tata Consultancy Services, India
Ulrich Prahl, Frieberg University of Mining and Technology, Germany

International Advisory Committee

Nadja Adamovic, TU Wein (Austria)
John Agren, KTH Royal Institute of Technology (Sweden)
Hector Basoalto, University of Birmingham (United Kingdom)
Arjann Buijk, Simufact/MSC Software (USA)
Jim Goddin, GRANTA Design (United Kingdom)
John Goldak, Goldak Technologies (Canada)
Begum Gulsoy, Northwestern University/CHiMaD (USA)
Satoshi Minamoto, National Institute of Materials Science (Japan)
Satyam S. Sahay, John Deere Technology Center India (India)
Georg Schmitz, Access (Germany)
Amarendra Singh, Indian Institute of Technology, Kanpur (India)
Zoran Sterjovski, Defence Science and Technology (DST) Group (Australia)
Jian-xin Xie, University of Science and Technology Beijing (China)

For More Information

For more information about this meeting, please complete the meeting inquiry form or contact:

TMS Meeting Services

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