*Website: IIT 2022
The International Conference on Ion Implantation Technology 2022 (IIT 2022) is the 23rd Conference in the biannual series focused on discussion of major challenges in current and emerging technologies related to implant/doping and annealing processes, device applications, equipment, metrology and modeling.
The Conference offers an excellent opportunity for engineers and researchers in industry, research institutes and universities to present new results and to discuss ideas of new applications of ion implantation and annealing.
The organizers welcome contributions from a wide range of topics, from fundamental research to industrial applications and equipment.
A three-day school on fundamental and practical aspects of ion implantation and annealing operations in research and IC production environments will be held prior to the 23rd International Conference on Ion Implantation Technology in San Diego, California, USA, in September 2022.
This school, which has preceded IIT meetings since 1982, will be taught by an expert group of a dozen instructors with many years of hands-on experience in the design, construction and operation of ion implantation and annealing to
ols as well as practical experience in process development and metrology.
All attendees of the school will receive a hardbound ≈600 page book containing tutorial chapters written by the instructors for follow-on study.
For more information, including topics and speaker information, please visit https://www.mrs.org/iit2022/school.
Plenary Speakers
Tony Renau, Varian Semiconductor Equipment (retired)
Development of Ion Implantation Technology: 1987-2022
Fred Roozeboom, University of Twente
Technical Developments of Thermal Annealing in the Past Sixty Years, and Future Perspectives
Hitoshi Wakabayashi, Tokyo Institute of Technology
Novel Processes and Devices including 2D Materials
Committees
Conference Chair
We commemorate Mitch Taylor, who left us before the conference could take place.
Conference Co-Chair
Susan Felch, Susan Felch Consulting
Technical Program Co-Chairs
Susan Felch, Susan Felch Consulting
Larry Larson, Texas State University
Sponsorships Chair
Aaron Vanderpool, Intel Corporation
Annealing Program Chair
Wilfried Lerch, SkyLark Solutions
Proceedings Chair
Larry Larson, Texas State University
Technical Program Committee Chair
Susan Felch, Susan Felch Consulting
International Committee Chair
Kevin Jones, University of Florida, USA
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