7th World Congress on Integrated Computational Materials Engineering (ICME 2023) (2023.5.21-25 *Orlando, Florida, USA)

*Website: ICME 2023


REGISTER NOW

The 7th World Congress on Integrated Computational Materials Engineering (ICME 2023) convenes leading researchers and practitioners to share the latest knowledge and advances in the discipline. This congress is the recognized hub of interaction among software developers and process engineers along the entire production chain, as well as for materials scientists and engineers developing new materials. This is the only congress dedicated to bringing all stakeholders together from across nations, disciplines, and organizations to focus on integration priorities and gaps that need to be addressed in order to advance the field.

ICME 2023 will benefit researchers, software developers, metallurgists, materials scientists and engineers, process engineers, senior scientists, chief technology officers, and a variety of others working in R&D. Attendees will gain insights on recent advances and discuss opportunities to overcome challenges in the field.


Congress Sponsors and Organizers

Hosted by the Materials Research Society, the Fall Meeting draws the entire materials research community to Boston to discuss topics across the fundamental and applied research spectrum.

This is not only an invaluable opportunity to advance your work, but also to:

*Explore a variety of hot topics, including:
- Predictive design
- Semiconductor technology
- Superconductor materials
- Polymer material science
- Quantum engineering and artificial intelligence
*Expand your professional network
*Enhance your leadership skills
*Help shape the future of the materials community
*Get free MRS membership with registration

This congress is sponsored by TMS Materials Processing &Manufacturing Division(MPMD) and the ? Integrated Computational Materials Engineering (ICME) Committee, and is being organized by the following individuals:

Chair Charles Ward, Air Force Research Laboratory, USA
Programming Chair Heather Murdoch, DEVCOM Army Research Laboratory, USA
Committee Durga Ananthanarayanan, IIT Bombay, India
Austin Mann, Boeing, USA
Victoria Miller, University of Florida, USA
Georg Schmitz, MICRESS group at ACCESS, Germany
Kandler Smith, National Renewable Energy Laboratory, USA
Sanjay Sondhi, GE Research, India

For More Information

TMS Meeting Services

5700 Corporate Drive Suite 750
Pittsburgh, PA 15237
Telephone:
U.S. and Canada Only: 1-800-759-4867
Other Countries: 1-724-776-9000
Fax: 1-724-776-3770
E-mail: mtgserv@tms.org